Very few components make it into the DOMINATOR family. Corsair performs rigorous testing and screening on all components to select only the best for the DOMINATOR modules. The tests check for high frequency and/or low latency capabilities for each IC. Then, they are thoroughly tested for maximum interoperability and reliability as a united group to meet the stringent design criteria demanded by performance computing and gaming users.
Heat is the enemy of your computer’s key components. And the more you tweak components for performance, the more heat is generated. Heat will slow down your system and impact long term reliability. With traditional DDR2 memory, the standard method of chip packaging involves a BGA (Ball Grid Array). In a BGA, small balls of solder, organized as a grid, are the leads that connect the device to the module circuit board. A Micron Semiconductor study shows that in a BGA memory device as much as 50 of the heat generated by the chip is actually conducted into the circuit board. Since traditional heat sinks are only attached to the front surface of memory chips, there’s no easy thermal path for the heat coming from the back of the chips.
Corsair’s engineers have developed a unique technology that maximizes heat dissipation while improving reliability, even in the most extremely overclocked memory module. Dual-Path Heat Exchange (DHX) technology utilizes two methods to effectively remove heat from the memory circuit board - Convection and Conduction.
The optional Airflow fan unit contains two 60mm tachometer-controlled fans to provide impinging airflow to the memory subsystem. With the moderate RPMs required to provide adequate forced air, the Airflow fan is nearly silent. The fan easily clamps onto most motherboards.
DOMINATOR is the industry’s performance and award leader. It has won numerous honors to date including various Editor’s Choice awards and several “Memory of the Year” honors.
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